TAFMER™ DF640
TAFMER™ DF640
The TAFMER™ DF of ethylene based copolymers is used to lower Heat Seal Initiation Temperature (HSIT) General characteristics attributed to TAFMER™ A:
• Low Melting Point for lowering Heat Seal Initiation Temperature (HSIT)
• Low Young’s Modulus for Softness and Flexibility
• Low Crystallinity for Transparency
• Low Glass Transition Temperature for Low Temperature Impact Resistance
• Miscible with PE and Compatible with PP for Adhesion Strength Control
In PE blown film, it is used to lower HSIT, improve transparency and adhesion strength to PP.
• Low Melting Point for lowering Heat Seal Initiation Temperature (HSIT)
• Low Young’s Modulus for Softness and Flexibility
• Low Crystallinity for Transparency
• Low Glass Transition Temperature for Low Temperature Impact Resistance
• Miscible with PE and Compatible with PP for Adhesion Strength Control
In PE blown film, it is used to lower HSIT, improve transparency and adhesion strength to PP.
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