Manufactured by MITSUI ELASTOMERS SINGAPORE PTE LTD
The TAFMER™ DF of ethylene based copolymers is used to lower Heat Seal Initiation Temperature (HSIT)
General characteristics attributed to TAFMER™:
• Low Melting Point for lowering Heat Seal Initiation Temperature (HSIT)
• Low Young’s Modulus for Softness and Flexibility
• Low Crystallinity for Transparency
• Low Glass Transition Temperature for Low Temperature Impact Resistance
• Miscible with PE and Compatible with PP for Adhesion Strength Control
In PE blown film, it is used to lower HSIT, improve transparency and adhesion strength to PP.
