The TAFMER™ DF of ethylene based copolymers is used to lower Heat Seal Initiation Temperature (HSIT) General characteristics attributed to TAFMER™ A: • Low Melting Point for lowering Heat Seal Initiation Temperature (HSIT) • Low Young’s Modulus for Softness and Flexibility • Low Crystallinity for Transparency • Low Glass Transition Temperature for Low Temperature Impact Resistance • Miscible with PE and Compatible with PP for Adhesion Strength Control In PE blown film, it is used to lower HSIT, improve transparency and adhesion strength to PP.
